Chapter 2 · Foundations
Semiconductor Switches
Every converter in this tutorial is built from a handful of semiconductor switches turning on and off. The switch you choose sets the converter's voltage rating, its efficiency, how fast it can switch and how hot it runs. This chapter explains how each family of devices conducts and blocks, how to model its losses, and how to pick one from a datasheet.
The ideal switch, and why no real one is ideal
An ideal switch has four properties. Real devices trade them against each other, and that trade-off is what separates one device family from another:
| Ideal property | What a real device does instead | Effect in a converter |
|---|---|---|
| Zero voltage drop when on | A resistance (R_{DS(on)}) or a fixed drop plus a resistance (V_{CE(sat)}, V_F) | Conduction loss |
| Zero current when off, at any voltage | Blocks up to a rated voltage, with a small leakage current; breaks down above it | Sets the voltage rating and the margin you need |
| Changes state instantly | Takes nanoseconds to microseconds; voltage and current overlap during the change | Switching loss, which grows with frequency (Chapter 3) |
| Needs no power to control | Needs a gate charge or a base current on every transition | Gate-drive loss and driver design (Chapter 8) |
The device families
Diodes: the uncontrolled switch
A diode conducts when its anode is more positive than its cathode and blocks otherwise. You can't turn it on or off; the circuit does. Converters use diodes as freewheeling paths: when a transistor turns off, the inductor current has to keep flowing somewhere, and the diode gives it a path. Three types matter:
- Silicon PN fast-recovery diodes block high voltages, but when they turn off they first conduct a burst of reverse current while stored charge is removed. That reverse-recovery charge Q_{rr} causes loss in the diode and in the transistor that turns on against it.
- Silicon Schottky diodes have a lower forward drop and almost no stored charge, but are practical only at low voltages, typically up to a few hundred volts.
- Silicon carbide (SiC) Schottky diodes combine high blocking voltage with almost no reverse recovery. They are a common upgrade in PV boost converters because they cut the turn-on loss of the main switch.
MOSFETs: voltage-controlled and fast
A MOSFET turns on when its gate-source voltage is raised above a threshold, typically by driving it to 10–15 V for silicon parts. Only majority carriers conduct, so there is no stored charge to remove and it switches very quickly. When on, it behaves like a resistor, R_{DS(on)}, and it can conduct in both directions. It also contains a body diode from source to drain, which conducts when the channel is off and current flows in reverse.
The catch is voltage. In silicon, the on-resistance of a MOSFET rises steeply with its voltage rating, so low-voltage silicon MOSFETs are excellent and high-voltage ones get expensive. Superjunction designs push silicon MOSFETs to around 600–900 V, which covers many single-phase inverters and boost stages.
IGBTs: MOSFET control, bipolar conduction
An insulated-gate bipolar transistor is driven like a MOSFET, through an insulated gate, but conducts like a bipolar transistor. Minority carriers flood the device and lower its resistance, so at high voltage and high current it conducts with a small, almost constant drop. The price is speed: at turn-off the stored carriers take time to disappear, producing a tail current that adds switching loss. IGBTs are available from 600 V up to several kilovolts and are the traditional choice for three-phase string inverters, central inverters and wind converters, usually at switching frequencies below about 20 kHz.
An IGBT conducts in one direction only, so it is almost always paired with an anti-parallel diode, often in the same package or module.
Wide-bandgap devices: SiC and GaN
Silicon carbide and gallium nitride are semiconductors with a much wider bandgap than silicon. A wider bandgap means a much higher critical electric field, so a device can block the same voltage with a thinner, more heavily doped drift region, and therefore with far less on-resistance and less charge to move when it switches.
| Material property | Silicon (Si) | Silicon carbide (4H-SiC) | Gallium nitride (GaN) |
|---|---|---|---|
| Bandgap | 1.12 eV | 3.26 eV | 3.4 eV |
| Critical electric field | ≈ 0.3 MV/cm | ≈ 2.5–3 MV/cm | ≈ 3.3 MV/cm |
| Thermal conductivity | ≈ 1.5 W/(cm·K) | ≈ 3.7–4.9 W/(cm·K) | ≈ 1.3 W/(cm·K) |
- SiC MOSFETs, commonly rated 650 V to 1,700 V (1,200 V is the most common), switch much faster than IGBTs with no tail current, and tolerate high temperatures. They suit 800 V DC links and 1,000–1,500 V PV systems, where they let designers raise the switching frequency and shrink the magnetics.
- GaN HEMTs, commonly rated 100 V to 650 V, are the fastest switches available. They have no body diode and so no reverse recovery, though they still conduct in reverse with a higher voltage drop. They suit compact, high-frequency converters such as microinverters and panel-level DC-DC converters. Their speed makes the gate driver and PCB layout critical.
Summary of the families
| Device | Controlled by | On-state model | Typical ratings | Speed | Typical renewable use |
|---|---|---|---|---|---|
| Si diode / SiC Schottky | The circuit | V_{F0} + r_D I | Up to kV | SiC: very fast | Freewheeling and boost diodes |
| Si MOSFET | Gate voltage | R_{DS(on)} \cdot I | Up to ≈ 600–900 V | Fast | Low-voltage DC-DC, single-phase inverters |
| IGBT | Gate voltage | V_{CE0} + r_{CE} I | 600 V to several kV | Moderate (tail current) | Three-phase and central inverters, wind converters |
| SiC MOSFET | Gate voltage | R_{DS(on)} \cdot I | 650–1,700 V | Very fast | High-voltage boost stages and string inverters |
| GaN HEMT | Gate voltage | R_{DS(on)} \cdot I | 100–650 V | Fastest | Microinverters, compact DC-DC |
Thyristors, the original power switch, still appear in very high-power line-commutated converters, but they can only be turned on by their gate, not off, so they play little part in the switch-mode converters of this tutorial.
Modelling conduction loss
When a switch is on, the power it loses depends on how its voltage drop varies with current. Two models cover every device in the table:
Resistive: MOSFET, SiC, GaN
Use the RMS current through the switch, and R_{DS(on)} at the hot operating temperature: for silicon it can roughly double between 25 °C and 125 °C.
Threshold + resistance: IGBT, diode
V_0 is the knee voltage (V_{CE0} or V_{F0}) and r the slope resistance, both read off the datasheet's output characteristic.
Because a MOSFET's drop grows in proportion to current while an IGBT's starts at a knee and then grows slowly, each one wins in a different current range:
Worked example: which device loses less?
Take the two devices in Figure 2.1, each conducting a steady DC current (so I_{avg} = I_{rms} = I):
| Current | MOSFET: I^2 \times 0.05 | IGBT: 1.0 \times I + 0.025 \times I^2 | Lower loss |
|---|---|---|---|
| 5 A | 1.25 W | 5 + 0.63 = 5.63 W | MOSFET |
| 20 A | 20 W | 20 + 10 = 30 W | MOSFET |
| 40 A | 80 W | 40 + 40 = 80 W | Equal |
| 60 A | 180 W | 60 + 90 = 150 W | IGBT |
Setting the two losses equal gives the crossover: I^2 R = V_0 I + r I^2, so I = V_0 / (R - r) = 1.0 / 0.025 = 40 A. This is why high-current converters at high voltage have traditionally used IGBTs, and why paralleling several MOSFETs, which divides R_{DS(on)}, is a common way to move the crossover up. Remember that the MOSFET's resistance rises when it gets hot, which moves the crossover down.
Choosing a voltage rating
A switch must block the highest voltage it will ever see, including the spikes caused by stray inductance when it turns off fast. Designers therefore leave a generous margin over the DC-link or input voltage:
| Maximum DC voltage in the circuit | Common device rating | Typical application |
|---|---|---|
| About 40–60 V (one PV panel) | 80–150 V | Panel-level optimizers, the low-voltage side of microinverters |
| About 400 V | 600–650 V | Single-phase inverters and their boost stages |
| About 800 V | 1,200 V | Three-phase string inverters |
| 1,000–1,500 V PV strings | 1,200–1,700 V, or multilevel circuits that share the voltage across several devices | Utility-scale string and central inverters |
Cosmic rays set a limit too
High-voltage power devices can fail suddenly when struck by cosmic-ray neutrons, and the failure rate rises sharply with the DC voltage applied as a fraction of the rating. Manufacturers publish failure rates against DC voltage for this reason. It is one more reason the steady DC voltage is kept well below the device rating, especially for equipment at high altitude.
Reading a datasheet
A switch datasheet holds dozens of numbers. These are the ones that decide whether a device suits a converter:
| Parameter | Meaning | Why it matters |
|---|---|---|
| V_{DS} / V_{CES} | Maximum blocking voltage | Must exceed the worst-case voltage including spikes |
| I_D / I_C | Continuous current, often quoted at a case temperature of 25 °C | Optimistic: check the curve at your real temperature |
| R_{DS(on)} or V_{CE(sat)} | On-state resistance or saturation voltage, against current and temperature | Conduction loss |
| Q_g, C_{iss}, C_{oss} | Gate charge and the device's capacitances | Switching speed, gate-drive power, capacitive switching loss |
| E_{on}, E_{off} | Energy lost per turn-on and turn-off, at a stated voltage, current and gate resistor | Switching loss (Chapter 3) |
| Q_{rr}, t_{rr} | Reverse-recovery charge and time of the diode | Turn-on loss in the opposite switch |
| V_{GS(th)}, V_{GS(max)} | Gate threshold and maximum gate voltage | Gate-driver voltages and noise margin (Chapter 8) |
| R_{th(j-c)}, T_{j(max)} | Thermal resistance from junction to case; maximum junction temperature | How much heat can be removed (Chapter 3) |
Compare devices at your operating point, not the headline
The front page of a datasheet quotes the best numbers: R_{DS(on)} at 25 °C and current at a case temperature of 25 °C, which no real heatsink achieves. Always compare devices using the curves at the junction temperature, voltage and current your converter will actually run at.
Exercise 1: MOSFET or IGBT?
A converter switch carries 15 A RMS and 12 A average. Option A is a MOSFET with R_{DS(on)} = 80 mΩ at operating temperature. Option B is an IGBT with V_{CE0} = 0.9 V and r_{CE} = 30 mΩ. Which has the lower conduction loss?
MOSFET: 15² × 0.08 = 18 W. IGBT: 0.9 × 12 + 0.03 × 15² = 10.8 + 6.75 = 17.55 W. The IGBT is slightly lower on conduction alone, but the difference is small, so the MOSFET's lower switching loss (Chapter 3) would probably decide in its favour at any significant switching frequency.
Exercise 2: pick a voltage rating
A boost converter steps a PV string up to a 750 V DC link. Turn-off spikes add up to 100 V. Which standard rating would you choose: 650 V, 900 V or 1,200 V, and why?
The switch sees up to about 850 V, so 650 V is out and 900 V leaves almost no margin. Choose 1,200 V, which in practice means a SiC MOSFET or a 1,200 V IGBT; it also keeps the DC voltage well below the rating, which matters for cosmic-ray robustness.
Key takeaways
- Real switches have an on-state drop, a voltage limit, finite switching speed and a gate that needs energy; each device family trades these differently.
- MOSFETs behave like resistors and switch fast; IGBTs have a knee voltage, conduct well at high current, and switch more slowly.
- SiC and GaN block high voltage with low resistance and little charge, which enables higher switching frequencies and smaller converters.
- Model conduction loss with I_{rms}^2 R or V_0 I_{avg} + r I_{rms}^2, using values at the hot operating temperature.
- Choose voltage ratings with generous margin, and compare devices at your real operating point.